Semiconductor manufacturing is a highly sophisticated process that transforms raw silicon into functional chips, requiring extreme precision and control over every step. The journey begins with silicon wafer production, where high-purity silicon ingots (grown via the Czochralski method) are sliced into thin, circular wafers—typically 12 inches (300mm) in diameter for advanced manufacturing. These wafers undergo rigorous cleaning to remove impurities, as even a single dust particle can render a chip defective.

The core of chip fabrication is the photolithography process, which transfers circuit patterns onto the silicon wafer. Using ultraviolet (UV) light, a photomask (containing the chip’s circuit design) projects patterns onto a photosensitive layer (photoresist) on the wafer. After exposure, the photoresist is developed, leaving a pattern that guides subsequent etching or deposition steps. Advanced nodes (e.g., 3nm, 2nm) use extreme ultraviolet (EUV) lithography, which employs shorter wavelengths to create finer circuit features, enabling higher transistor density.